Reliability Evaluation of High Pin Count Hermetic Ceramic IC Packages for Space Applications

John J. Barrett, Tyndall National Institute at National University of Ireland, Cork
Thomas F. Hayes, Tyndall National Institute at National University of Ireland, Cork
Rory Doyle, Tyndall National Institute at National University of Ireland, Cork
Sean Cian Ó. Mathúna, Tyndall National Institute at National University of Ireland, Cork
Takashi Yamada, Tyndall National Institute at National University of Ireland, Cork
Alberto Boetti, ESTEC - European Space Research and Technology Centre

Abstract

The results to date of a reliability testing program for the European Space Agency on high pin count hermetic ceramic packages are presented. The program commenced in 1988 and has the following objectives: • to determine the fundamental reliability, for space applications, of high pin count ceramic packages from manufacturers world wide; • to measure the thermal resistances and electrical parameters of these packages and to compare these with theoretically derived values; • to evaluate the reliability of different solder assembly techniques for high pin count, fine pitch, surface mount IC packages on printed circuit boards; • to work on the generation of specifications and guidelines for the selection and assembly of high pin count IC packages for space applications. Results are presented from work on: • application of scanning acoustic microscopy (SAM) to die attach and lid seal quality assessment; • the use of thermal characterization test chips and a computer controlled thermal resistance measurement system to measure thermal impedances of ceramic quad flat pack (CQFP) and ceramic pin grid array (CPGA) packages; • numerical prediction and practical measurement of electrical parasitics of CQFP and CPGA packages; • quality and reliability testing of CQFP and CPGA packages; • quality and reliability testing of 20 and 25-mil pitch surface mount solder assemblies of high pin count CQFP packages assembled on printed circuit boards. © 1992 IEEE