A computer‐controlled environmental test system for high pin‐count integrated circuit packages
Abstract
An automated environmental stress testing system, designed and assembled for testing of high pin‐count integrated circuit packages and surface mount solder joint reliability is described. Details are given of the software and hardware used in the control of the environment chambers used, in monitoring of test specimen reliability parameters and in control and monitoring of special purpose integrated circuits for testing of IC package reliability. In addition, an automatic system for monitoring of the resistance of fine pitch surface mount solder joints and for detection and recording of thermally induced intermittent open circuits in these joints is described. Copyright © 1993 John Wiley & Sons, Ltd.
This paper has been withdrawn.