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S. Lesecq, Universite Grenoble Alpes O. Debicki, Universite Grenoble Alpes J. Foucault, Universite Grenoble Alpes L. Ouvry, Universite Grenoble Alpes M. Correvon, Centre Suisse d'Electronique et de Microtechnique SA G. Dudnik, Centre Suisse d'Electronique et de Microtechnique SA J. Barrett, Cork Institute of Technology S. Rea, Cork Institute of Technology A. McGibney, Cork Institute of Technology F. Birot, GoSense H. De Chaumont, GoSense L. Sevrin, GoSense R. Banach, The University of Manchester J. Razavi, The University of Manchester J. Herveg, University of Namur N. Grandjean, University of Namur C. Jackson, ON Semiconductor S. Buckley, ON Semiconductor A. Di Matteo, STMicroelectronics V. Di Palma, STMicroelectronics C. Ó'Murchú, Tyndall National Institute at National University of Ireland, Cork A. Mathewson, Tyndall National Institute at National University of Ireland, Cork R. O'Keeffe, Tyndall National Institute at National University of Ireland, Cork
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